Sil-Pad K10 is a special film to the substrate, high performance elastomeric insulation material with excellent cut resistance and excellent thermal conductivity. Is widely used in electrical and electronic industries. When used, depending on the size and height of the interface gap fever select thermal silica films with different thickness cut, placed in the gap at the interface of its components heat, from the role of a heat transfer medium.

Sil-Pad K10是一种以特殊薄膜为基材的高性能弹性体绝缘材料，具有优良的抗切割能力和极好的导热性能。被广泛应用于电子电器等行业。使用时，根据发热界面的大小及间隙高度选择不同厚度的导热硅胶片裁切，安放在发热界面与其组件的空隙处，起导热介质作用。

Features 特性：                            

. Thermal conductivity 熱傅導率: 0.9W/m-K、1.1W/m-K、1.3W/m-K

. High pressure resistance  耐高压

. High dielectric strength  绝缘强度高

. Durable 耐用

Applications 產品應用端：

. Power Supplies  电源

.  Motor Control  马达控制

.  Power semiconductors  功率半导体

Performance parameters 性能参数：