LBD-GP3000 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

LBD-GP3000 系列热传导界面材料是填充发热器件和散热片或金属底座之间的空气间隙，它们的柔性、弹性特征使其能够用于覆盖非常不平整的表面。热量从分离器件或整个PCB传导到金属外壳或扩散板上，从而能提高发热电子组件的效率和使用寿命。

Features 特性：                                   Applications 產品應用端：

.Thermal conductivity 熱傅導率: 3.0W/m-K           . Computer services: CPU, Heat sink, Memory modules

. Very soft & high compressibility 超軟及高壓縮性   . LED Lighting, LCD-TV

. Natural tacky 自黏性                             . Military Electronics

. Good Electrically isolating 高耐電壓             . Power Supplies

. Easy to assembly 易於施工                         . Telecom services, Wireless instruments

. Cost effective 價格合理                          . Automotive control services  

Material property 材料特性：