LBD-PC thermal potting fast curing, high thermal conductivity, low coefficient of expansion, excellent electrical insulation properties, in a wide range of temperature and humidity changes, long-term, reliable protection of sensitive circuits and components has excellent electrical insulation, moisture-proof and waterproof certain flame retardant properties, can withstand environmental pollution, to avoid damage due to stress and vibration and humidity and other environmental factors on the product caused, especially for heat dissipation requirements of the potting material good product. The product has excellent physical and chemical resistance, minimal shrinkage, thermal curing process and hold no solvents or cure byproducts, with repair, can solidify into elastomer deep.

LBD-PC导热灌封胶能快速固化，高导热，膨胀系数低，电气绝缘性能优越，在大范围的温度及湿度变化内,可长期可靠保护敏感电路及元件具有优良的电绝缘、防潮防水及一定的阻燃性能，能抵受环境污染，避免由于应力和震动及潮湿等环境因素对产品造成的损害,尤其适用于对灌封材料要求散热性好的产品。该产品具有优良的物理及耐化学性能，极小的收缩性，固化过程中不放热没有溶剂或固化副产物,具有可修复性 ，可深层固化成弹性体。

Features 特性：                            

. Thermal conductivity 熱傅導率: 1.0 W/m-K

. Superior resistance to high temperature resistance  优越的耐高低温性

.  Power module. Chemical stability and mechanical properties  功率模块、化学性能和机械性能稳定

Applications 產品應用端：                     Product Configuration  产品配置： 

. Power Modules 电源模块                           . 5 KG/Pot  5 KG/罐

.  LED drive power LED 驱动电源                                       .  10 KG/Pot   10 KG/罐

.  Telecommunications equipment  电信设备

.  Integrated chips  集成芯片

Material property  材料特性：